Feature(all dim. in mm)	Current Process Capability
	Standard	Advanced*
Max. Layer Count	2-10	12-16
Min. Drill Size (PTH)	0.30 mm	0.25 mm
Min. Finished hole	0.25 mm	0.20 mm
Diameter plated hole tolerane	+/-0.08 mm	+/-0.05 mm
Diameter non plated hole tolerane	+/-0.05 mm	+/- 0.03 mm
Diameter press fit hole tolerance	+0.09/-0.06 mm	+/- 0.04 mm
Positioning hole tolerance	+/-0.08 mm	+/-0.05 mm
Max. Aspect ratio (Base on finished hole)	7:1	8:1
Min. Board thickness	0.80 mm	0.40 mm
Max. Board thickness	2.40 mm	3.20 mm
Finished board thickness tolerance	+/-10%	-
Min. Core thickness	0.075 mm	0.063 mm
Min. Prepreg thickness	0.075 mm	0.063 mm
Min. Copper foil thickness	0.5 oz	0.33 oz
Max. Copper foil thickness	3 oz	4 oz
Min. Inner layer Line / Space	0.10/0.10 mm	0.075/0.075 mm
Min. Outer layer Line & Space	0.10/0.10 mm	0.075/0.075 mm
Pattern registration tolerance	+/-0.075 mm	+/-0.05 mm
Min. Pad size over drill	Drill + 0.25 mm	Drill + 0.20 mm
Min. Solder mask clearance	0.08 mm	0.05 mm
Min. Solder mask web between pads	0.08 mm	-
Min. Soldermask registration tolerance	+/-0.08 mm	+/-0.05 mm
Max. plugged hole diameter	0.40 mm	0.50 mm
Min. Legend width	0.20 mm	0.15 mm
Min. Size of carbon pad	Cu pad + 0.40 mm	Cu pad + 0.30 mm
Min. Spacing between carbon pads	0.40 mm	0.30 mm
Routing dimension tolerance	+/-0.13 mm	+/-0.10 mm
Punching dimesion tolerance	+/-0.15 mm	+/-0.13 mm
Scoring angle	30, 60 degree	90 degree
Scoring web thickness tolerance	+/-0.13 mm	+/0.10 mm
Beveling angle	20, 30, 45 degree	-
Warp and Twist	0.7%	0.5%
Impedance Single ended tolerance	+/-10%	+/-7%
Impedance Differential tolerance	+/-10%	+/-7%
Impedance Coplanar Tolerance	+/-10%	+/-7%
Min. Nickel thickness	2.50 uM	4.0 uM
Hard gold plated thickness	0.20-0.76 uM	0.76-1.0 uM
Min. Immersion gold thickness	0.05 uM	0.08 uM
Min. Immersion Tin thickness	0.8 uM	1.0 uM
Min. Immersion Silver thickness	0.2-0.4 uM	-
OSP (Entek HT) thickness	0.2-0.5 uM	-
Lead Free HASL thickness	1-25 uM	-
HASL thickness	1-25 uM	-

.

Feature(all dim. in mm)	Current Process Capability
	Standard	Advanced*
Blind Via size (Laser drill)	0.10-0.20 mm	-
Min. Target / Capture Pad diameter for laser blind via	Drill + 0.25 mm	Drill + 0.20 mm
Max. Laser blind via depth	0.075 mm	0.115 mm
Max. Aspect Ratio (Base on laser drill size)	0.6:1	0.7:1
Sequential Lamination	0.6:1	0.7:1
Sequential Lamination	-	Yes
HDI Type Construction	Type I, Type II	Type III, Stack via, Stragger via
Build Up Layers	1-N-1, 2-N-2	3-N-3
Copper Fill Plating for laser blind via	Yes	-
Max. Dimple for Cu fill in laser blind via	30 uM	20 uM
Min. Pad size over mechnical buried via	Drill + 0.25 mm	Drill + 0.20 mm
Finished hole size for Via in Pad Technology / Plated over filled via (POFV)	0.30 mm	0.25 mm
Min. Pad size over drill for via in pad technology	Drill + 0.30 mm	Drill + 0.25 mm

Feature	Current Process Capability
	Standard	Advanced*
FR-4 (Lead Free material)	Tg 140, 150,170 'C	Tg 180 'C
FR-4 (Halogen Free material)	Tg 150 'C	Tg 170 'C
CAF Resistant Laminate	YES	-
Solder mask Printing	Taiyo PSR-4000 (matte, glossy), Probimer 77 (semi-matte)	-
Solder mask color	Green	Blue, White
Via Plugging solder mask	Taiyo and Peter	-
Legend color	White / Yellow	-
Peelable mask on board	Peter SD2954, Blue color	-
Carbon Ink	Tamura MRX-713J	-
Kapton tape	YES	-

Feature	Current Process Capability
	Standard	Advanced*
External Heat Sink on PCB	YES	-
Outside Semi-Flex PCB	1 Cu layer bendable	2 Cu layer bendable
Middle Semi-Flex PCB	-	2 Cu layer bendable
Bending Ability (Semi-flex PCB)	90 degree	180 degree
Total flex thickness	0.20-0.50 mm	0.15-0.30 mm
Depth routing tolerance	+/- 0.15 mm	+/- 0.10 mm